The Titi Tudorancea Bulletin
English Edition. October 17, 2007
Published on October 17, 2007
 

Broadcom announces 3G "Phone on a Chip"

DANIEL STEFANITA

Broadcom Corporation (Nasdaq: BRCM), announced a new single-chip processor that integrates all of the key 3G (third generation) cellular and mobile technologies on an extremely low power, single CMOS chip: HSUPA (High-Speed Uplink Packet Access), HSDPA (High-Speed Downlink Packet Access), WCDMA (Wideband Code Division Multiple Access), and EDGE (Enhanced Data for GSM evolution). It can also transmit and receive FM radio on a car stereo, supports Bluetooth technology, and has processing capability for a 5-megapixel camera.

"Broadcom's new '3G Phone on a Chip' solution enables manufacturers to build next generation 3G HSUPA phones with breakthrough features, sleek form factors and very long battery life, all at a fraction of the cost of today's solutions - driving widespread consumer adoption. Never before has anyone integrated as many radio devices on a single chip, which demonstrates Broadcom's technology leadership in multi-modal CMOS RF technology." (Broadcom)

Broadcom is one of the world's largest fabless semiconductor companies, with 2006 revenue of $3.67 billion and a rival of Qualcomm.


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